PENGARUH ARANG AKTIF DALAM CAMPURAN BAHAN BAKU TERHADAP KARAKTERISTIK PAPAN PARTIKEL
Main Article Content
Abstract
Formaldebyde emission andpbysical-mechanical properties of particleboard bonded with urea formaldehyde (UF) could have negative effects to buman bealth, especially when used in a room with limited ventilation. To reduce formaldebyde emission, anadsorbentcan be applied to raw material as a mixture. This report describes the effect of active charcoal application on formaldehyde emission and physical-mechanical properties of the bonded particleboard.
Results showed that application of active charcoal in particleboard production significant changed the product properties. Active charcoal addition as much as 20% of the particle weight to raw material could reduce formaldebryde emission andincreaseplrysical-mechanical propertiesof particleboard, and meet the Indonesian and Japanese Standards.
Article Details
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.
References
Benaddi, H., T.J. Bandosz., J. Jagiello., J.A. Schwarz., J.N. Rouzaud., D. Legras, and F. Benguin. 2000. Surface functionality and porosity of activated carbon obtained from chemical activation of wood. Carbon 38:
-674. UK.
CPSC.1997. An Update On Formaldehyde: 1997. Revision. http://www.cpsc.gov [27 Marret 2007].
Dynea. 2005. Resin for ultra low formaldehyde emission according to the Japanese F**** quality. San Diego. Manfred Dunky.
Hawks, L.K., and A.B. Hansen. 2002. Formaldehyde. Utah University Ekstention. Electronic Publishing. http://www.utah.ac. [27 Maret 2007].
Haygreen, J.Gdan Bowyer, J.L. 1996. Hasil Hutan dan Ilmu Kayu: Suatu Pengantar (terjemahan). Gadjah Mada University Press.Yogyakarta.
Japan Industrial Standard [JIS]. 2003. Particleboard.JIS A 5908. Tokyo: Japanese Standards Association.Tokyo.
Liteplo, R.G., R. Beauchamp, M.E. Meek, and R. Chenier. 2002. Formaldehyde. Concise International Chemical Assessment Document 40. Geneva. WHO.
Malik J dan A Santoso. 2006. Emisi formaldehida kayu lamina dari tiga jenis kayu hutan tanaman dengan perekat tanin, lignin dan fenol. Jurnal Nusa Kimia. Vol. 6(1): 34 39. Bogor.
Pari G., Kurnia S., Wasrin S., and Buchari. 2006. Tectona grandis activated charcoal as catching agent of formaldehyde on plywood glued with urea formaldehyde. Proceedings of the 8 Pacific Rim Bio-
Based Composites Symposium. Kuala Lumpur. Malaysia.
Park, S.B., Su-Won K., Jong-Young P., dan Jung- Kwan Roh. 2006. Physical and Mechanical Properties and Formaldehyda Emission of
Particleboard with Bamboo Charcoal. Journal of Forest Science 69:50-59. Czech Republic.
Roffael, Edmone; transleted from German text and edited by K. C. Khoo, M. P. Koh and C.L. Ong, 1993. Formaldehyde Release From Particle Board and Other Wood Based Panel, Malaysia: Forest Research Institute Malaysia (FIRM) with technical assistance from Malaysia-German Forestry Research Project (GTZ).
Rong, H., Z: Ryu., J. Zheng, and Y. Zhang. 2002. Effect of air oxidation of rayon-based activated carbon fibers on the adsorption behavior for formaldehyde. Carbon 40: 2291-2300. UK.
Santoso A dan P Sutigno. 2004. Pengaruh fumigasi amonium hidroksida terhadap emisi formaldehida kayu lapis dan papan
partikel. Jurnal Penelitian Hasil Hutan. Vol. 22(1): 9 - 16. Bogor.
Santoso A and YS Hadi. 2005. Low formaldehyde emission particleboard bonded by tannin based adhesives. Jurnal Teknologi Hasil Hutan 18(1): 17-20.Bogor.
Santoso A dan G Pari, 2010.Teknik pencampuran arang aktif pada ramuan perekat urea formaldehida. Laporan Hasil Penelitian. Pusat Penelitian dan Pengembangan Keteknikan Kehutanan dan Pengolahan
Hasil Hutan, Bogor.
Standar Nasional Indonesia (SNI). 1995. Arang aktif teknis. SNI 06-3730-1995. Jakarta. Badan Standardisasi Nasional Indonesia. Standar Nasional Indonesia (SNI). 2000. Papan Partikel. SNI 03-2105-2000. Jakarta.
Badan Standardisasi Nasional Indonesia. Standar Nasional Indonesia (SNI). 2005. Emisi formaldehida pada panel kayu. SNI 01- 7140-2005. Jakarta. Badan Standardisasi Nasional Indonesia.
Sudjana. 2002. Desain dan Analisis Eksperimen. Tarsito, Bandung
Wang, W., X. Zang, and R. Lu. 2004. Low formaldehyde emission paricleboard bonded by UF-MDI mixture adhesive.Forest Product Journal 54(9): 36-39.Madison.
